With our foundry-based process for fabrication, integration and packaging of MEMS, MicroAssembly offers off-the-shelf and custom solutions for MEMS commercialization. Our quick-turn prototyping capability reduces time-to-market, while our foundry-based process offers rapid scaling to manufacturing. MicroAssembly will consider risk-sharing partnerships to develop leading-edge MEMS components and modules. Currently, our specialty products include:

• High-g linear accelerometers, High-g and low-g rotary accelerometers

  2,000g to 100,000g accelerometers for munition fuzing applications. Rotary accelerometers for harddrive vibration compensation and munition fuzing applications.

• Ultra-high density interconnect substrates

  Our technology enables chip-chip or thru-wafer interconnects at extremely tight pitches.