RF MEMS switches enable wireless device manufacturers to dramatically reduce system level power consumption. Under development are low-loss and extremely-linear switches for diversity antenna, transmit-receive, load-match, and frequency-band select.

MicroAssembly’s RF MEMS process incorporates RF switches, high-Q passives and other RF components via a proprietary interconnect technology enabling MEMS/CMOS integration. This process also leverages our proprietary wafer-scale hermetic packaging capability for low-cost.

An advanced actuator design enables high contact forces to provide reliable operation.