MicroAssembly has wafer-scale and die-scale MEMS packaging capability, with the flexibility to rapid-turn for prototyping and also meet volume requirements with low-cost. Why MicroAssembly's micropackage is different:

• Low temperature processing -- compatible with a wide variety of MEMS devices -- from room temperature to 300 C
• Wafer scale: large volumes at low cost
• Die scale: quick turnaround prototyping
• Very thin, non-contaminating, metal-to-metal seals – no organics
• Near 100% yield -- reliability data with demonstrated hermeticity and very strong bond strength
• Harsh environments including cryogenic temperatures and high-g shock